Stencil printing

rdf:langString Stencil printing

rdf:langString y

rdf:langString August 2022

rdf:langString "nb"

rdf:langString Stencil printing is the process of depositing solder paste on the printed wiring boards (PWBs) to establish electrical connections. It is immediately followed by the component placement stage. The equipment and materials used in this stage are a stencil, solder paste, and a printer. The stencil printing function is achieved through a single material namely solder paste which consists of solder metal and flux. Paste also acts as an adhesive during component placement and solder reflow. The tackiness of the paste enables the components to stay in place. A good solder joint is one where the solder paste has melted well and flowed and wetted the lead or termination on the component and the pad on the board. In order to achieve this kind of a solder joint, the component needs to be in the right place, the right volume of solder paste needs to be applied, the paste needs to wet well on the board and component, and there needs to be a residue that is either safe to leave on the board or one that can easily be cleaned. The solder volume is a function of the stencil, the printing process and equipment, solder powder, and rheology or the physical properties of the paste. Good solder wetting is a function of the flux.