Redistribution layer
http://dbpedia.org/resource/Redistribution_layer an entity of type: AnatomicalStructure
A redistribution layer (RDL) is an extra metal layer on an integrated circuit that makes its IO pads available in other locations of the chip, for better access to the pads where necessary. When an integrated circuit is manufactured, it usually has a set of IO pads that are wirebonded to the pins of the package. A redistribution layer is an extra layer of wiring on the chip that enables bond out from different locations on the chip, making chip-to-chip bonding simpler. Another example of the use for RDL is for spreading the contact points around the die so that solder balls can be applied, and the thermal stress of mounting can be spread.
rdf:langString
rdf:langString
Redistribution layer
xsd:integer
32008772
xsd:integer
1099476477
rdf:langString
A redistribution layer (RDL) is an extra metal layer on an integrated circuit that makes its IO pads available in other locations of the chip, for better access to the pads where necessary. When an integrated circuit is manufactured, it usually has a set of IO pads that are wirebonded to the pins of the package. A redistribution layer is an extra layer of wiring on the chip that enables bond out from different locations on the chip, making chip-to-chip bonding simpler. Another example of the use for RDL is for spreading the contact points around the die so that solder balls can be applied, and the thermal stress of mounting can be spread.
xsd:nonNegativeInteger
1102